从上图可以看出，键合异常为键合裂纹和和发光区及焊盘下方外延层损坏。

从上图可以看出，键合异常为键合裂纹和和发光区及焊盘下方外延层损坏。

結果 (英文) 1:

It can be seen from the above figure that the abnormal bonding is a bonding crack and damage to the epitaxial layer under the light-emitting area and the pad.

結果 (英文) 2:

It can be seen from the above figure that the bonding abnormalities are bonding cracks and damage to the epitaxial layer under the luminous area and pad.

結果 (英文) 3:

As can be seen from the above figure, the bonding abnormalities are bonding cracks and damage of the epitaxial layer under the light emitting region and the pad.