检测备注：1#传感器阻值漂移严重。在高倍显微镜下观察发现该只传感器包封

检测备注：
1#传感器阻值漂移严重。在高倍显微镜下观察发现该只传感器包封头部环氧树脂开裂（详见附件图一、图二），该现象可能是导致芯片阻值异常的主要原因。

检测结论：
1#属不合格品；
2#电性能属合格品。

結果 (英文) 1:

Testing notes:1# sensor drift serious resistance. At high magnification microscope found crack epoxy resin encapsulation of the sensor head (see Appendix a, figure II), this phenomenon might be the chip resistance of the main cause of the exception.Test conclusion:1# is a nonconforming product;Electrical properties of 2# to be qualified.

結果 (英文) 3:

Test notes:1# sensor resistance drift seriously. Observation under the microscope found that the only sensor package sealing head epoxy resin cracking (refer to appendix Figure 1, figure 2). This phenomenon may lead to the main cause of the abnormal chip resistance.Detection conclusion:1# substandard goods;2# electrical properties are qualified products.