从上图可以看出，键合异常为键合裂纹和和外延层及焊盘下方发光区损坏。

从上图可以看出，键合异常为键合裂纹和和外延层及焊盘下方发光区损坏。

結果 (英文) 1:

It can be seen from the above figure that the abnormal bonding is a bonding crack and damage to the light-emitting area under the epitaxial layer and the pad.

結果 (英文) 2:

It can be seen from the above figure that the bonding abnormalities are bonding cracks and damage to the epitaxial layer and the light-emitting area under the pad.

結果 (英文) 3:

As can be seen from the above figure, the bonding abnormalities are bonding cracks and damage of the epitaxial layer and the light emitting area under the pad.